Panacol Launches Fast-curable Epoxy Resin Adhesive

Panacol, a leading international manufacturer of industrial and medical grade adhesives , has launched Structalit® 5604. New Structalit® 5604 is an extremely fast-curing adhesive which is specifically developed for bonding SMDs to printed circuit boards.

The adhesive is based on epoxy resin and is, despite its high viscosity, suitable for jet application. Structalit® 5604 is a one-component epoxy resin adhesive that contrasts well with green PCB material due to its red color.

This makes it possible to ensure visual inline inspection. The one-component adhesive can be dispensed in production through jetting, valve dispensing or screen printing. Its ideally adjusted viscosity and high thixotropy index enable high-speed dispensing, precise dot profiles, and non-slumping wet adhesion before curing.

Structalit® 5604 is cured with heat. The process of thermal curing takes place in a matter of minutes, even at low temperatures. When fully cured, the adhesive is extremely temperature resistant. It can withstand short-term temperatures of up to 270°C, making it suitable for reflow soldering processes.

This adhesive is particularly shock-resistant and durably adheres to FR4 printed circuit boards, metals, and epoxy-based molded materials. Thanks to its high glass transition range of >115°C, the adhesive is ideal for electronic component assembly. It does not lose adhesion or soften at elevated temperatures.

Since Structalit® 5604 was developed specifically for use in electronics, it has high ionic purity and thus provides optimum protection against internal corrosion.

Source